Precision SMT Tooling

PCB Stencil Fabrication Services

Ultra-precise laser-cut stainless steel stencils engineered for flawless solder paste deposition. Eliminate bridging, minimize voids, and perfect your SMT yield.

Upload Paste Data View Tolerances

Stencils for Every Assembly Line

From manual prototyping to high-speed automated pneumatic printers, we manufacture form factors to fit your exact machinery.

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Framed Stencils

Permanently mounted on cast aluminum frames using high-tension mesh. Ideal for high-volume, automated SMT printing.

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Frameless (Foil)

Laser-cut metal foils designed to work with universal tensioning systems. Cost-effective and space-saving for storage.

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Prototype Stencils

Custom-sized frameless stencils intended for manual solder paste application using squeegees during R&D phases.

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Step Stencils

Multi-level thickness routing. Step-up for large components requiring more paste, step-down for fine-pitch micro-BGAs.

Machining Tolerances

Our advanced fiber lasers cut with micrometer precision, ensuring perfect paste release ratios for ultra-fine pitch components.

Standard Thickness 0.08mm - 0.20mm

Positional Accuracy ± 12.5 µm

Aperture Tolerance ± 5.0 µm

Max Cutting Area 736mm × 736mm

Fiducial Types Half-cut (Etched) & Full-cut

Advanced Aperture DFM

We automatically calculate Area Ratios (AR) and Aspect Ratios to guarantee paste release. Our DFM engineers perform standard modifications:

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Anti-Tombstone Shrinkage: Home-plate or U-shape modifications for passive 0402/0201s.
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Thermal Pad Windowing: Window-pane cuts for QFN thermal pads to prevent float.
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Corner Rounding: Eliminating sharp corners to prevent paste sticking.

Industrial-Grade Materials

We utilize FG304 Fine Grain Stainless Steel as our standard baseline, providing superior tension retention and smoother aperture walls compared to standard SUS304. For extreme micro-pitch requirements, we offer Electroformed Nickel foils.

FG304 Stainless Steel Electroformed Nickel Tensioned Polyester Mesh Cast Aluminum Frames

Fabrication Workflow

Gerber Parsing

Extracting Paste (GTP/GBP) layers and verifying alignment.

DFM Modification

Aperture shrinkage and windowing to optimize Area Ratios.

Fiber Laser Cutting

Micron-level cutting with real-time thermal stabilization.

Post-Processing

Electropolishing and optional Nano-coating for smooth release.

Advanced Post-Processing

Raw laser cuts leave microscopic burrs (dross) that can trap solder paste. We offer advanced chemical treatments to guarantee perfect paste roll and release.

⚡ Electropolishing

An electrochemical process that strips away microscopic burrs from the aperture walls, resulting in a mirror-smooth finish. Highly recommended for fine-pitch ICs.

💧 Nano-Coating

A hydrophobic polymer coating applied to the squeegee side and aperture walls. It repels flux, reduces under-stencil wiping frequency by 50%, and massively improves print yields.

Quality Inspection Standards

Every stencil is subjected to extreme scrutiny. We utilize Stencil AOI (Automated Optical Inspection) to scan 100% of the apertures against your original Gerber data, ensuring zero missing or malformed cuts. For framed stencils, we digitally measure mesh tension to ensure it meets strict Newton limits (N/cm) for perfect snap-off dynamics.

Precision Examples

Stencil Fabrication FAQs

Do I need to modify my own paste layers for shrinkage?

No. You can send us your 1:1 paste layers. Our CAM engineers will automatically calculate and apply the necessary aperture shrinkages and windowing based on standard IPC DFM guidelines.

What thickness should I choose for my stencil?

Thickness depends on the finest pitch component on your board. As a general rule, use 0.10mm (4mil) for fine-pitch 0402s and QFNs, 0.12mm (5mil) for standard SMT, and 0.15mm (6mil) for larger components. We can also provide Step Stencils if you need variable thicknesses on the same board.

How do you handle fiducial marks?

We can cut them as "Full-Cut" (holes entirely through the metal) or "Half-Cut/Etched" (partially etched into the squeegee or PCB side) depending on your automatic printer's camera requirements.

Is Electropolishing really necessary?

For components smaller than 0603 or pitches finer than 0.5mm, electropolishing is highly recommended. It smooths the rough edges left by the laser, preventing paste from adhering to the stencil walls and ensuring a clean brick of solder paste on the pad.

Need a Precision Stencil?

Upload your Paste Gerber files (GTP/GBP) to the A7 Control Room for instant fabrication.

Upload Paste Data

Indian Delivery Partners

BLUE DART

DTDC

Trackon

delhivery

Mahaveer

NANDAN

ACPL Avinash Cargo

VRL Transport

Bus Service Available