Technical Capabilities
From rapid single-layer prototypes to complex high-density interconnect (HDI) multi-layer boards, review our exact manufacturing tolerances and production limits below.
PCB Manufacturing Capability Specifications
Full tolerance and production parameter reference for our PCB manufacturing line — covering base material specifications, drilling and routing precision, trace and solder mask limits, and available surface finishes for every fabrication order.
Base Specifications
Core board construction parameters
| Parameter | Manufacturing Limit / Capability |
|---|---|
| Layer Count | 1 to 6 Layers |
| Base Materials | FR4, High Tg, Halogen Free |
| Board Thickness | 0.4mm to 3.2mm (± 10% Tolerance) |
| Maximum Board Size | 400mm x 350mm |
| Copper Thickness | 1.0 oz to 3.0 oz (Outer & Inner) |
Layer Count
1 to 6 Layers
Base Materials
FR4, High Tg, Halogen Free
Board Thickness
0.4mm to 3.2mm (± 10% Tolerance)
Maximum Board Size
400mm x 350mm
Copper Thickness
1.0 oz to 3.0 oz (Outer & Inner)
Drilling & Routing
Mechanical precision limits
| Parameter | Manufacturing Limit / Capability |
|---|---|
| Minimum Drill Size | 0.15mm (6 mil) |
| Hole Size Tolerance (PTH) | ± 0.075mm |
| Hole Size Tolerance (NPTH) | ± 0.05mm |
| Routing Tolerance | ± 0.15mm |
Minimum Drill Size
0.15mm (6 mil)
Hole Size Tolerance (PTH)
± 0.075mm
Hole Size Tolerance (NPTH)
± 0.05mm
Routing Tolerance
± 0.15mm
Tracing & Masking
Copper trace and solder mask limits
| Parameter | Manufacturing Limit / Capability |
|---|---|
| Min Trace Width / Spacing | 3 mil / 3 mil |
| Impedance Control Tolerance | ± 10% |
| Solder Mask Colors | Green, Blue, Red, Black, White, Yellow, Matte Black |
| Silkscreen Colors | White, Black, Yellow |
| Min Solder Mask Dam | 4 mil (0.1mm) |
Min Trace Width / Spacing
3 mil / 3 mil
Impedance Control Tolerance
± 10%
Solder Mask Colors
Green, Blue, Red, Black, White, Yellow, Matte Black
Silkscreen Colors
White, Black, Yellow
Min Solder Mask Dam
4 mil (0.1mm)
Surface Finishes
Available plating & coating options
| Parameter | Manufacturing Limit / Capability |
|---|---|
| HASL (Lead-Free) | Available (RoHS Compliant) |
| ENIG (Electroless Nickel Immersion Gold) | Available (1U" to 3U" Gold) |
| OSP (Organic Solderability Preservative) | Available |
| Immersion Silver / Tin | Available upon request |
| Hard Gold Plating | Available for edge connectors |
HASL (Lead-Free)
Available (RoHS Compliant)
ENIG (Electroless Nickel Immersion Gold)
Available (1U" to 3U" Gold)
OSP (Organic Solderability Preservative)
Available
Immersion Silver / Tin
Available upon request
Hard Gold Plating
Available for edge connectors
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